Development direction of passive device
1. integrated modularization is the trend of the future development of passive devices. The integrated module provides the ability to integrate active devices, modules, and passive components, while achieving modular downsizing and low cost requirements. The main methods include: low temperature co fired ceramic technology (LTCC), thin film technology, silicon semiconductor technology, multilayer circuit board technology, etc..
2. miniaturization. The wireless industry's pursuit of a smaller and more lightweight requires passive devices to grow in a smaller direction. The main use of micro electro mechanical systems (MEMS), RF components smaller size, lower cost, more powerful, and more conducive to integration.
3. package effect. Compared with the commonly used surface mounted passive components, the integration of components in the package can effectively improve the reliability of the system, shorten the conductive path, reduce parasitic effects, reduce costs and reduce device size.