Advanced system level packaging design services
It is called system package (SiP) to integrate many different devices, such as semiconductor and passive devices, into a single package or micro module. This enables a particularly fast and low cost development cycle. This paper introduces the key advantages of RF application development specifically for SiP, such as Insight and SiP of the company is how to through full turnkey design services (Full-Turnkey), and how to use their own advanced packaging design method to help customers succeed.
Radio frequency system integration using SiP method has become the key of micro route. Although more and more integrated in a single chip function (system on chip concept) is a long-term trend, but small personal growth in the world without end equipment complexity system continues to promote the use of SiP to achieve full of people. Radio frequency SiP can be achieved using a variety of techniques, each manufacturing suppliers have their own special aspects; therefore need to be cut according to different materials, physical deposition methods and properties of SiP, in order to adapt to the specific design rules.
No matter which packaging / assembly technology is adopted, such as organic substrate (BT, FR4)...... Multilayer ceramic substrates (LTCC, HTCC, thick films)...... ), wire binding, flip chip, thin film integrated passive devices or silicon or glass (IPD) and so on, the design company partner within the package the RF professional knowledge and unique ability to combine the important function of embedded.
Why does the SiP approach meet today's challenges?
With the increasing popularity of embedded consumer electronic products, more and more complex functions, it is very important for new equipment to meet the requirements of low power consumption and smaller aspect ratio, while maintaining a strong price competitiveness. Therefore, engineers and product development team is facing many challenges, including the narrow node no longer will reduce cost of each transistor (from 65nm) in SoC, development time, non recurring engineering cost and risk of failure (NRE) with the development of every generation nodes continued to rise and high growth markets (networking, car...... It requires integration of different functions (memory, MCU, GPU, analog device, RF device, MEMS, CIS) in a small space with high cost...... ).
Lower power consumption has become the most important alternative to faster IC requirements, and through the existing RF protocol devices (such as cellular), or the emerging network (such as LoRa, SigFox, LTE-M, NB-IoT and LPWAN) to realize wireless connection. Only the SiP method can help meet these typical requirements because this system partitioning can provide the power to go beyond Moore's law, and SiP modularity can simplify the implementation of different functions into digital SoC. By encapsulating multiple bare sheets in a IC package, the power consumption can be reduced by 3 to 10 times compared to the installation of multiple independent packages of bare chips onto printed boards.
The multi die IC design and manufacturing process is maturing, and they can reduce NRE and shorten development time, thus enabling SiP to have a good economy for small and medium volume. IDM and non factory IC vendors that have released many middleware based IC products are now stepping up production and are developing more such 2.5D-IC designs. Large open foundries such as TSMC (TSMC) have also invested heavily in their own multi chip packaging lines, and most large OSAT companies have developed and offered WLP solutions. In addition, a number of EDA vendors offer user-friendly modeling and design tools that can not only minimize development time and reduce risk, but also reduce the cost of multi die IC.