Passive device development direction
1. Integrated modularization is the trend of the future development of passive devices. The integrated module provides the ability to integrate active devices or modules and passive devices, while at the same time meeting the requirements for module reduction and low cost. The main methods include: low temperature co-fired ceramics (LTCC), thin film technology, silicon semiconductor technology, multi-layer circuit board technology.
2. Miniaturization. The pursuit of greater miniaturization and lighter weight in the wireless industry requires passive devices to be more compact. The main use of microelectromechanical systems (MEMS) is to make RF components smaller in size, lower cost, more powerful, and more conducive to integration.
3. Package effect. Compared with commonly used surface-mounted passive components, integrating the components in a package can effectively improve the reliability of the system, shorten the conduction path, reduce parasitic effects, reduce costs, and reduce device size.