Electroplating difference of RF connectors
Electroplating of RF connectors has a certain impact on the overall price and performance of the product. For the choice of plating materials, the advantages and disadvantages of each material are determined according to the needs of the environment! Let Xiaotian tell you about the difference between several main plating materials!
First, the bright nickel plating layer - it is a widely used and relatively inexpensive plating. It is mainly used for the outer conductor and housing part of the universal connector. It is used more for general commercial connectors. It has good corrosion resistance and salt spray resistance, and should not be used for products with intermodulation requirements.
Second, the bright silver plating layer - this is the best conductivity plating. For some high-end military products, silver must be plated. However, the hard and hard silver plating is high in cost, and the disadvantage is that after the surface protective film is destroyed, it is easily vulcanized in the atmosphere, yellowing and blackening.
Third, plating ternary alloy - this is a copper-tin-zinc alloy, the ratio is: copper 55%, tin 30%, zinc 15%. It is a substitute for silver plating and nickel, its chemical properties are relatively stable, and it has been widely used by products with intermodulation requirements.
Fourth, the gold plating layer - the gold layer is relatively stable, not easy to corrode, and the electrical conductivity is inferior to the silver plating layer. Since the thickness of the gold plating layer directly affects the wear resistance, the thicker the price, the higher the price.
Tiankele RF connector manufacturer is a professional manufacturer of RF connectors. It has a complete production line, three quality inspections, and an excellent rate of 99.99%, so that you can completely get rid of the troubles of delivery and bad products. If you have any in this regard, Demand, Tiankele is always ready for you, 24-hour customer service phone 13684973846
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